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Daicel-Degussa Ltd. (headquartered in Shinjuku-ku, Tokyo, under Representative Director & President Taiji Yamabe) focused on the idea of directly bonding different materials through the chemical reaction occurring at their interface, and successfully developed a boding technology as well as materials suitable for the technology. The new technology can bond complex parts in a manner offering high performance and durability, thereby minimizing the environmental impact and limitations on material combinations. (See the table below.)
Conventional bonding methods, such as those using adhesives and thermo-adhesion methods that utilize the structural similarity of bonded materials, impose various limitations on material combinations. In some cases these methods cause undesirable results in terms of the durability of bonded layers. Additionally, there are concerns over the negative environmental impact associated with the organic solvents used in the pre-treatment processes and the adhesives used in the conventional technologies.
Contrastingly, bonding via the K&K process minimizes the limitations on material combinations and does not use any organic solvent. As a result, many of the problems associated with the conventional methods are eliminated.
The K&K process, when it was first developed, supported only the combination of modified PPE resin and SBR subject to special inter-polymer action. However, the active introduction of a concept referred to as ¡Èbonding by interfacial reaction¡É led to the addition of various types of hard polyamide materials to the lineup, as well as the expanded range of applicable soft materials to include high-function rubbers such as H-NBR and FKM, difficult-to-bond rubbers such as EPDM and VMQ, and thermoplastic elastomers such as TPU. Accordingly, the K&K process now supports a wider range of material combinations.
The K&K process is already used in the production of automotive parts, electronic equipment parts and sporting equipment. Some of these items have employed the K&K process in their manufacture for 15 years or more. The bonding mechanism of the process has been verified through internal testing by Daicel-Degussa as well as basic research projects sponsored by the Chemicals Evaluation and Research Institute, Japan. Backed by these proven records and the technology¡Çs demonstrated reliability, we will actively propose K&K-process-based technical and material solutions to manufacturers and assist them in developing new applications for the K&K process.
We will exhibit our PEEK resin, K&K process and sample products at SAMPE JAPAN 2007, which will be held November 28-30 (at Tokyo Big Sight).
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